SK Hynix Readies 8 GB RAM Chips For 2017 Mobile Devices

SK Hynix has quietly unveiled its new 8 GB LPDDR4 mobile DRAM package that is aimed ath future smartphones and tablets. The chips will be made using the older 21nm manufacturing process, but will offer better price/performance ratio compared to the more efficient 10nm process Samsung is using for its 8 GB module.SK Hynix has quietly unveiled its new 8 GB LPDDR4 mobile DRAM package that is aimed ath future smartphones and tablets. The chips will be made using the older 21nm manufacturing process, but will offer better price/performance ratio compared to the more efficient 10nm process Samsung is using for its 8 GB module.

There is no mention of power consumption, but the 8 GB module from SK Hynix will be running at 3.73GHz, with each chip rocking 4 x 2GB modules, offering bandwidth of up to 29.8Gbps. Due to lower price, the new module is most likely to be used in more affordable devices.
There is no mention of power consumption, but the 8 GB module from SK Hynix will be running at 3.73GHz, with each chip rocking 4 x 2GB modules, offering bandwidth of up to 29.8Gbps. Due to lower price, the new module is most likely to be used in more affordable devices.

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