The two main chipset manufacturers on the smartphone market are definitely Qualcomm and MediaTek, since they make the most chipsets, but there are also other very competitive companies such as Huawei, Samsung, Apple and the newcomer Xiaomi.
Unlike Qualcomm and MediaTek, these companies mostly make chipsets for their own devices and they are very competitive. While Samsung and Xiaomi unveiled their latest chipsets, Huawei and Apple have yet to do that and we now have more details on the upcoming chipset from Huawei.
The next-generation Kirin chipset will be built using TSMC's 10nm FinFET process that hopefully will mature since then. It will have an octa-core processor and ARM Heimdallr MP GPU, which has yet to be announced. There will be support for full network, 5 carrier aggregation and for most of the global frequency bands. The Kirin 970 also includes Cat. 12 LTE baseband, which is still pretty far from Cat. 12 LTE on Snapdragon 835.
The chipset is expected to be announced in the coming months, but don't expect to see it in action before the P11 becomes official.
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